• Brand
  • HPE


  • Series
  • Storage MSA 2040


  • Type
  • Bundle – (DC Power) Chassis + 2x SAN Controllers + 6x 900GB SAS 10K + 4x 200GB S…


  • Capacity
  • ۶.۲TB


  • Platter size
  • ۲.۵″


  • Current drives
  • ۲۴


  • Total Drives
  • ۱۰


  • Rack size
  • ۲


  • company
  • HP
    Qnap
    EMC
  • CPU

  • AMD R-Series RX-421ND quad-core 2.1 GHz processor, turbo core up to 3.4 GHz Hardware Encryption Engine: Yes, AES-NI

  • System Memory

  • ۸GB DDR4 (2 x 4GB)

  • Maximum Memory

  • ۶۴GB (4 x 16GB)

  • Memory Slot

  • ۴ x UDIMM DDR4 (For dual- or quad-DIMM configurations, you must use a pair of identical DDR4 modules.)

  • Flash Memory

  • ۵۱۲MB DOM

  • Drive Bay

  • ۱۶ x 3.5″/2.5″ SATA 6Gb/s HDDs/SSDs

  • M.2 SSD Slot

  • ۲ x M.2 2280 SATA 6Gb/s SSDs Note: ۱. The M.2 SSD is not included as standard. ۲. M.2 SSD operations can easily generate excessive heat. It is recommended to install a heatsink (from QNAP or a third-party provider) on the M.2 SSD.

  • ۱۰ Gigabit Ethernet Port

  • ۲ x 10GbE SFP+ port via a preinstalled PCIe network card

  • Gigabit Ethernet Port

  • ۴ x Gigabit RJ45 LAN ports

  • PCIe Slot

  • ۱ x PCIe Gen 3 (x4), pre-installed with a dual-port 10GbE SFP+ LAN card

  • USB

  • ۲ x USB 3.0 port ۴ x USB 2.0 port

  • Form Factor

  • ۳U Rackmunt

  • Dimension (H x W x D)

  • ۱۳۰ x 481 x 536 mm ۵.۱۲ x 18.94 x 21.10 inch

  • Weight

  • ۱۵.۰۱ kg (33.09 lbs.)

  • Operating Temperature

  • ۰ ~ ۴۰˚C ( 32˚F ~ 104˚F ), 5 ~ 95% RH non-condensing, wet bulb: 27˚C

  • Power

  • ۵۰۰W (x2), 100-240V AC, 50/60 Hz

  • Min/Max Drives


  • ۶/۱۵۰۰
  • Array Enclosure


  • A 2U Disk Processor Enclosure (DPE) with twenty five 2.5” drives
  • Drive Enclosure (DAE – Disk Array Enclosure)


  • All-Flash (F) models support 2.5” drives in 2U twenty five drive and 3U eighty drive trays. Hybrid models support 2.5“ drives in 2U twenty five drive and 3U eighty drive trays; and 3.5” drives in 3U fifteen drive trays.
  • Standby Power System


  • Dell EMC Unity systems are powered by 2 power supplies (PS) per DPE/DAE. Each power supply can provide power to the entire module if the peer PS has been removed or is faulted. DPE power during a power failure is provided by a Battery Back Up (BBU) module. BBU is located within the SP enclosure and provides power to a single module (power zone)
  • RAID Options


  • ۱/۰, ۵, ۶
  • CPU per Array


  • ۲ x dual-socket Intel CPUs, 64 cores per Array, ۱.۸GHz
  • System Memory/Cache per Array


  • ۷۶۸GB
  • Max FAST Cache per Array


  • Up to 6 TBs
  • Total Cache


  • Up to 6.76 TBs
  • Max Mezzanine cards per Array


  • ۲
  • Max IO Modules per Array


  • ۴
  • Embedded SAS IO Ports per Array


  • ۴*۴ lane 12Gb/s SAS ports for BE Connection
  • Optional SAS IO ports per Array


  • ۸*۴ lane or 4 x 8 lane ۱۲Gb/s SAS ports (for BE Connection)
  • Max 12 Gb/s SAS BE Buses per Array


  • ۶*۴ Lane; or 2 x 4 lane and 2 x 8 lan
  • Max FE (front end) Total Ports per Array (all types)


  • ۲۴
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